OptEM offers a range of software products that provide accurate electromagnetic and signal integrity analysis of high-speed high-performance electronic interconnects. Fabrication information and standard design datafiles are used throughout all of OptEM's software products to simplify the input process. On output, the software tools provide a variety of detailed reports, interconnect SPICE models, reflection and crosstalk values, S-parameter plots, and other critical signal integrity information for design engineers.
The software tools offered are divided between two main applications:
1) data, communication, subsea umbilical and specialty cable design, modeling and analysis, with cable/connector system modeling and
2) submicron integrated circuit (IC) device, interconnect and substrate extraction with IC package interconnect modeling and general pre-layout interconnect design.
Software for the design, modeling and analysis of flex, unshielded twisted pair (UTP) and shielded twisted pair (TP) cables.
Software for the modeling and analysis of high-performance connectors and related interconnect media.
RC device, interconnect and substrate extraction software for submicron analog, digital and mixed-signal ICs.
Pre-layout parametric interconnect design and analysis software that investigates the effects of design changes on the electrical performance of a system.
Post-layout verification software for the extraction, electromagnetic analysis, and modeling of package interconnects.