Here you'll find information about OptEM's upcoming and past events, access to software technical support, links to download technical papers, and links to other resource information we find interesting and helpful.
DAC: June 8-10, 2015- OptEM will be exhibiting in booth 2215 at the 52nd Design Automation Conference in San Francisco, CA, USA. The DAC is the premier conference and tradeshow covering the latest trends in electronic design and design automation (EDA). Please join us at the show and see our latest release ofOptEM Inspectora layout-to-circuit device and interconnect RC and substrate extraction of deep submicron analog, digital and mixed-ICs.
IWCS: October 5-6, 2015- OptEM will be exhibiting in booth 207 at the International Cable-Connectivity Symposium (formerly the International Wire & Cable Symposium) in Atlanta, GA, USA. The IWCS is the world's premier venue for the presentation of new and original wire and cable industry technologies and trends. OptEM will demonstrateOptEM Cable Designera software tool used for accurate modeling and analysis of high-performance multi-conductor shielded and unshielded twisted-pair, quad, ribbon, subsea umbilical and specialty cables, as well as flex circuits from DC to 10 GHz.
OptEM Cable Designer software training - see ourschedulefor the next 2-day training course nearest you. Don't see a scheduled course that's convenient for you? Pleasecontact usand we'll see what we can arrange.
On May 5, 2014 Dr. Juliusz Poltz, the president and co-founder of OptEM, was awarded the Urbain J. H. Malo Memorial award by the Wire Association International (WAI) for the best 2013 technical paper in the Electrical Division. The paper is entitled "Optimizing Shielded Pair Manufacturing" and was originally presented at the Interwire Trade Exposition, 83rd WAI Annual Convention, in April 2013 in Atlanta, GA. The paper examines a method for estimating the expected tolerance of cable propagation properties based on available manufacturing tolerances and calculated sensitivities. The work establishes that the twinax cable insulation diameter and copper/skin eccentricity are responsible for attenuation tolerance, whereas copper and skin diameters are responsible for characteristic impedance tolerance. This best paper (electrical division) award was presented to Dr. Poltz during the WAI annual meeting held at the WAI Operations Summit & Wire Expo in May 2014 in Indianapolis, IN.
In June 2013 OptEM was presented with an Exhibitor Recognition Award for 20 or More Years of Participation at the Design Automation Conference. TheDACis the premier conference and tradeshow covering the latest trends in electronic design and design automation (EDA). The 2013 DAC celebrated 50 years of innovation in EDA with a special banquet and ceremonial events at the conference in Austin, TX, USA. OptEM was pleased to receive this award and participate in this special event.
OptEM presented a paper entitled "Optimizing Shielded Pair Manufacturing" at the Interwire Trade Exposition, 83rd WAI Annual Convention in Atlanta, GA, USA. The paper examines a method for estimating the expected tolerance of cable propagation properties based on available manufacturing tolerances and calculated sensitivities. For more information please review the paperabstract.
The Wire Association International(WAI)Inc. is a worldwide technical society for wire and cable industry professionals governed by volunteers from around the world.Interwireis an international trade event that includes exhibitors, speakers and attendees working in a variety of industries including automotive, construction, aerospace, transportation, communication, among others.
July 2014 - Release of OptEM Cable Designer version 7.3 with:
October 2010 - Release of OptEM Cable Designer version 6.5.0 with new Advisor Modules: