Today, the combination of shrinking feature size, increased packing density, increased interconnect length, and faster clock rates have created new challenges for engineers developing high-performance digital and analog systems.

This course is designed to provide a theoretical review and understanding of the advantages and disadvantages of the different electromagnetic analysis, numerical techniques, and transmission line theory used for high-performance signal integrity analysis. Justification for when interconnect modeling is needed is described together with different modeling techniques. Methods for identifying and reducing signal integrity and timing problems are also discussed. Learn how to generate new design rules from pre-layout analysis for the next generation of high-performance digital and analog systems.

The format of the course includes a combination of tutorial presentations, open discussions on the materials in the course, and software demonstrations if time and resources permit. Practical application of fundamentals is stressed and maximum interaction with the instructor and other participants is encouraged. To aid this interaction it is suggested that participants bring their own design problems for discussion and simulation.

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