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Electromagnetic Modeling
and Signal Integrity Analysis Software
OptEM Engineering develops CAE software for electromagnetic and signal
integrity analysis of electronic interconnects. OptEM's software focuses on
interconnect extraction, modeling and characterization of deep-submicron ICs,
advanced IC packages, and connector/cable systems.
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 Chip Level
OptEM Inspector
is a device and interconnect RC extraction software tool for deep-submicron
digital, analog, and mixed-signal IC designs.
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Connectors
OptEM Connector
performs electromagnetic analysis and SPICE modeling of high-speed cables and
related interconnect media.
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Cables
OptEM Cable Designer
designs and analyses high-performance multi-conductor twisted pair cables.
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Packages
OptEM Package
is a post-layout verification tool for the extraction, electromagnetic
analysis, and modeling of advanced IC package interconnects.
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Pre-Layout
OptEM Interconnect Designer
is a pre-layout parametric design and signal integrity analysis tool that
investigates the effects of design changes on the electrical performance of
a system.
OptEM ID Application Note
Determining the dimensions of a 100 Ohm stacked dual stripline.
More Information
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