OptEM Engineering develops CAE software for electromagnetic and signal integrity analysis of electronic interconnects. OptEM's software focuses on interconnect extraction, modeling and characterization of deep-submicron ICs, advanced IC packages, and connector/cable systems.

Chip Level

OptEM Inspector is a device and interconnect RC extraction software tool for deep-submicron digital, analog, and mixed-signal IC designs.
 

Connectors

OptEM Connector performs electromagnetic analysis and SPICE modeling of high-speed cables and related interconnect media.
 

Cables

OptEM Cable Designer designs and analyses high-performance multi-conductor twisted pair cables.
 

Packages

OptEM Package is a post-layout verification tool for the extraction, electromagnetic analysis, and modeling of advanced IC package interconnects.
 

Pre-Layout

OptEM Interconnect Designer is a pre-layout parametric design and signal integrity analysis tool that investigates the effects of design changes on the electrical performance of a system.
 
OptEM ID Application Note
Determining the dimensions of a 100 Ohm stacked dual stripline.
 

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