OptEM ID is a pre-layout parametric design and signal integrity analysis tool that investigates the effects of design changes on the electrical performance of a system.

The combination of shrinking feature size, increased packing density, increased interconnect length, and faster clock rates have caused interconnect delays to dominate and 2nd order effects such as cross-coupling to become significant. Engineers facing these new interconnect challenges need software tools that can quickly and easily characterize the electrical performance of interconnects. OptEM ID provides the ability to perform "what-if" analyses, generate statistical information and set up interconnect design rules for today's high-performance digital and analog systems.

OptEM ID is a parametric design and analysis tool that allows you to investigate how the electrical characteristics of an interconnect structure change as input parameters change. Often, in the final manufactured product, many design parameters differ from their original specifications. Variables representing frequency, material characteristics, cross section geometries, and other parameters, can be defined and analyzed over a range of values. As a result you can investigate the effect that these parametric changes have on the electrical performance of the interconnect system.

OptEM ID provides a cross section editor that is used to define design rules. Variables can be set up for all geometric parameters of a cross section. Then each cross section can be analyzed parametrically and statistically. Through a frequency-dependent current distribution analysis, OptEM ID can calculate interconnect circuit models with extreme accuracy. The results indicate parameter dependent output properties like inductance and resistance. Changes of inductance and resistance due to the skin effect, if not planned for, may cause the device to become inoperable.

Using parametric, statistical, and circuit analyses, OptEM ID is able to predict resistance, capacitance, inductance, crosstalk, and other parasitic effects. Performing a parametric analysis allows you to see how different parameters affect each other. The Monte Carlo statistical analysis in OptEM ID offers an efficient method of including the manufacturing tolerances and statistical distributions when calculating the electrical characteristics of an interconnect. OptEM ID builds a frequency-dependent S-parameter model of the network which can be used with other microwave applications. In the time-domain OptEM ID predicts crosstalk, reflection, and ground bounce in circuits.

The analyses provided by OptEM ID generate a variety of reports, models, and graphical plots. OptEM ID reports can include R, L, C, and G matrices, and time delay information. Both SDF and SPICE interconnect models are available. Graphical plots include two- and three-dimensional parametric plots, stair step graphs and bar charts from the Monte Carlo analyses, and Cartesian plots of signal waveforms for time and frequency domain analyses.

minimum 64 MB RAM, 128 MB swap, 30 MB disk, and

Sun SPARC workstation running Solaris 7 or 8, or

HP 9000 Series 700 workstation running HP-UX 10.x

ability to define design parameters and assign manufacturing tolerances

parametric analysis

statistical analysis

time-domain analysis

frequency-domain analysis

cross section editor that models multi-dielectrics and multi-conductors deposited on conformal or flat layers

cross section circuit definition

batch analysis

generate design rules for cross sections

study the effect of parameter variations

study the effect of manufacturing tolerances

generate complex multiport S-parameters

transient simulation of reflection, crosstalk, and ground bounce

differential source/return pairs, even/odd mode impedance, and reassignment of ground

allows concurrent modeling and analysis

Determining the Dimensions of a 100 Ohm Stacked Dual Stripline

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